In recent years, with the continuous deepening of research on semiconductor luminous materials, the continuous progress of high-power LED light source manufacturing process and the development and application of new materials (nitride crystals and phosphors), ultra-high brightness leds of various colors have made breakthroughs, which makes it possible for LED applications to span the high-efficiency lighting source market. However, the development of LED lighting system is largely affected by heat dissipation problems, for high-power LED, heat dissipation problem has become a bottleneck problem restricting its development.

The U.S. Department of Energy (DOE) recently released new requirements for LED LAMPS that will take effect on August 1.

"Hopefully, it will be on the market by the end of July." Liyang Optoelectronics Co., LTD. (hereinafter referred to as "Liyang shares") executive deputy general manager Qin Shengyan told Gao Gong LED.

On July 17, 2016, China LED(Darco Optical Cup) badminton tournament was hot in Shenzhen. The 32 representative teams of industry companies organized by the organizer Shenzhen Lighting and Display Engineering Industry Association gathered at Shenzhen Nanshan Jinyu Badminton Court. With the sound of passionate music, the beauties of Liyang Shares opened the opening ceremony of the "Dalco Optical Cup" with a fiery opening dance.

Technological innovation and market demand are the two major powers for the development of the LED industry. Throughout the development of LED packaging in China, it has experienced from the early pin-type LED devices, patch type printed circuit board (PCB) structure, polyphthalamide (PPA), polyadimethylate terephthalate (PCT) to the current aluminum nitride ceramic structure, high-power integrated on-board chip packaging (ChipOnBoard). COB), thermosetting epoxy resin (EMC) structure LED devices, various types of crystal coating and other different forms of packaging.